Capacitor save energy verification

ABSTRACT

A memory subsystem includes a volatile memory, a nonvolatile memory, and a controller including logic to interface the volatile memory to an external system. The volatile memory is addressable for reading and writing by the external system. The memory subsystem includes a power controller with logic to detect when power from the external system to at least one of the volatile and nonvolatile memories and to the controller fails. When external system power fails, backup power is provided to at least one of the volatile and nonvolatile memories and to the controller for long enough to enable the controller to back up data from the volatile memory to the nonvolatile memory.

TECHNICAL FIELD

The present disclosure relates to hybrid memory systems includingvolatile and nonvolatile memory components, and to monolithicnonvolatile memories that require stored energy in a capacitor ortemporary use of a battery to perform a save operation upon power loss.

BACKGROUND

There are many computing applications that may benefit from the use offast nonvolatile memory. These include disk caches, solid-state drives,hard disk emulation, hybrid drives, and file systems.

For example, popular PC file systems based on FAT (File AllocationTables) and NTFS (New Technology File System) have frequently writtenfile management data associated with the storage of the files. This iscalled “metadata”—the data that manages the file system. For a FAT32 andFAT16 based file system this is termed “FAT”, for a NTFS file systemthis is called MFT (Master File Table).

Accurate metadata is essential to the operation of the file system. Filesystems might save their metadata on one or multiple (for redundancy)disk files. However, the importance of the metadata, the frequency ofmetadata access and alteration, and the need for speed when accessing oraltering metadata, make metadata well suited for storage in anonvolatile RAM instead of slower disk files (or wear-sensitive NANDFlash devices), and/or as a disk cache for file system operations.

A traditional block or page accessed nonvolatile RAM such as a limitedendurance (Erase Write cycling) Multi Level Cell (MLC) NAND flash devicemay be used to store frequently accessed data. However, directly readingand writing a NAND flash device for applications involving frequentmemory operations may prove slow and cumbersome, due to the non-RAM(e.g. block-sequential) access methods typically associated with suchdevices. The frequently-altered nature of data in such applications maycause premature memory system failure because NAND flash devices havelimited erase/write capabilities before they may wear out and becomeunreliable. This may result in unreliable system operation and mayultimately necessitate the replacement of the NAND flash. More frequentNAND flash replacement may greatly increase the life-cycle cost of thesystem.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, the same reference numbers and acronyms identifyelements or acts with the same or similar functionality for ease ofunderstanding and convenience. To easily identify the discussion of anyparticular element or act, the most significant digit or digits in areference number refer to the figure number in which that element isfirst introduced.

FIG. 1 is a block diagram of an embodiment of a hybrid memory subsystem.

FIG. 2 is a flow chart of an embodiment of a data backup process.

FIG. 3 is a flow chart of an embodiment of a data restoration process.

FIG. 4 is a block diagram of an embodiment of a hybrid memory subsystemthat provides an external system with an SDRAM interface.

FIG. 5 illustrates an embodiment comprising more than one backup powercapacitors.

FIG. 6 is a flow chart of an embodiment of capacitor power verificationat system power-up.

FIG. 7 is an illustration of an embodiment of a capacitor dischargecurve under a predetermined load (R) and voltage.

FIG. 8 is a diagram of an embodiment of an LC (inductive-capacitive)loop circuit.

FIG. 9 is a flow chart of an embodiment of a process to initialize ahybrid memory subsystem.

FIG. 10 is flow chart of an embodiment of a process whereby the hybridmemory subsystem responds to a resumption of external system powerduring a power-down save operation initiated as a result of externalsystem power failure.

FIG. 11 is a memory allotment map for several power down nonvolatilememory capacity situations.

FIG. 12 is a flow chart of an embodiment of the power up restore processfor a hybrid memory subsystem.

FIGS. 13 and 14 are flow charts of an embodiment of a hybrid memorysubsystem power down process, invoked after external system power fails.

FIG. 15 is a block diagram of an embodiment of variable partitioning ina hybrid memory subsystem.

DETAILED DESCRIPTION

References to “one embodiment” or “an embodiment” do not necessarilyrefer to the same embodiment, although they may.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” Words using the singular or pluralnumber also include the plural or singular number respectively.Additionally, the words “herein,” “above,” “below” and words of similarimport, when used in this application, refer to this application as awhole and not to any particular portions of this application. When theclaims use the word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list and anycombination of the items in the list.

“Logic” refers to signals and/or information that may be applied toinfluence the operation of a device. Software, hardware, and firmwareare examples of logic. Hardware logic may be embodied in circuits. Ingeneral, logic may comprise combinations of software, hardware, and/orfirmware.

Those skilled in the art will appreciate that logic may be distributedthroughout one or more devices, and/or may be comprised of combinationsof instructions in memory, processing capability, circuits, and so on.Therefore, in the interest of clarity and correctness logic may notalways be distinctly illustrated in drawings of devices and systems,although it is inherently present therein.

Hybrid Memory Subsystem

FIG. 1 is a block diagram of an embodiment of a hybrid memory subsystem.The subsystem provides a low-cost, high density, non-volatile memory byusing a low-cost volatile memory 102 in conjunction with a low-costnon-volatile memory 104.

The memory subsystem includes, but may not be limited to, SDRAM 102(volatile memory), NAND FLASH 104 (nonvolatile memory), analog powercontrol circuitry 106, power capacitor 108, and a system controller 110.Other elements and/or couplings among the elements may be apparent toskilled practitioners in the relevant art(s).

The volatile memory in this embodiment is an SDRAM 102 (SynchronousDynamic Random Access Memory). Other types of volatile random accessmemory may also be used. The nonvolatile memory in this embodiment is aNAND FLASH 104, and again, other types of nonvolatile memory may beused.

The analog power control circuitry 106 interfaces the memory subsystemto an external power source, typically the power source of a largersystem that incorporates and uses the hybrid memory subsystem. Forexample, the external power source may be the power of personal orbusiness computer system that incorporates the memory subsystem.

The analog power control circuitry 106 also interfaces the memorysubsystem to a backup power source that is local to the memorysubsystem. The backup power source may be, for example, a capacitor 108or small battery (or a combination of the two). In the embodiment ofFIG. 1, a capacitor 108 provides power to the memory subsystem for atemporary time when external power fails. The capacitor 108 may providepower for long enough to copy data blocks from volatile memory 102 tononvolatile memory 104.

In the event of an external power failure, the hybrid memory subsystemmay operate as an isolated subsystem of the larger, external system. Theanalog power circuitry 106 may recognize that external system power hasfailed. The system controller 110 may then initiate backup of datacurrently stored in the volatile memory 102 into the non-volatile memory104. Herein, the term “backup” means that data of the volatile memory102 is stored into the nonvolatile memory 104. Upon restoration ofexternal system power, the system controller 110 may initiaterestoration of backed-up data from non-volatile memory 104 to volatilememory 102. Herein, the term “restore” and “restoration” means that dataof the nonvolatile memory 104 is stored into the volatile memory 102.

The system controller 110 may thus include logic to backup data fromvolatile memory 102 to nonvolatile memory 104 when the external powersource fails, and to restore data from nonvolatile memory 104 tovolatile memory 102 when the external power source becomes available.

Those skilled in the art will appreciate that various functionalcomponents, such as the power controller logic 106 and the systemcontroller logic 110, and even the volatile memory 102 and nonvolatilememory 104, may in fact be implemented together as one or moreintegrated circuit devices, and packaged as one or more discretephysical components.

Data stored within the hybrid memory subsystem persists even when thepower of the external system fails. The external system may interactwith the hybrid memory subsystem as though interacting with volatilememory 102 (of the same or another type), even though, transparently,the data is stored internally by the memory subsystem in nonvolatilememory 104 persistently in the absence of external system power.

The hybrid memory system may write data to non-volatile memory 104 onlyin the event that external system power fails. Thus, the non-volatilememory 104 undergoes many fewer write cycles than would occur if it werebeing written every time data were written to the hybrid memorysubsystem. When the non-volatile memory 104 is a low-cost, limited dutycycle NAND FLASH, the result in an extension of the useful lifetime ofthe non-volatile memory 104.

The system controller 110 provides a memory interface to the externalsystem. The memory interface may comprise a standard data and controlinterface for some particular kind of volatile memory. For example, thesystem controller may provide an SDRAM data, address, and controlinterface to the external system. The interface provided to the externalsystem may or may not be the interface for the type of volatile memory102 actually used by the memory subsystem.

The system controller 110 may additionally provide an interface wherebythe external system may send commands to the hybrid memory subsystem orobtain status. For example, in some embodiments the external system maycommand the hybrid memory subsystem to initiate a backup of data fromvolatile memory 102 to non-volatile memory 104, even though the systempower is still available. Additionally or alternatively, the hybridmemory subsystem or external system may provide a direct user interface,such as a switch or control on a graphic user interface, whereby a userof the external system may directly initiate a copy of data fromvolatile 102 to non-volatile memory 104. Another action which may insome embodiments be initiated either through the system interface of thesystem controller 110, or directly by a user, is restoring data fromnon-volatile memory 104 to volatile memory 102. In some embodiments theexternal system may use its system interface to the hybrid memorycontroller 110 to initiate a self test of the hybrid memory subsystem.

Other examples and/or embodiments of the various system components maynow be apparent to skilled practitioners in the relevant art(s).

Hybrid Memory Subsystem Operation

As previously described, the system controller 110 may comprise logic tointerface the volatile memory 102 to an external system, such as apersonal computer system or a business computer system. Other examplesof applications of the hybrid memory subsystem are embedded controlapplications, communications, and consumer products.

The system controller 110 may present an interface to the externalsystem, so that the volatile memory 102 is addressable for reading andwriting of data by the external system.

Logic of the power controller 106 may detect when power from theexternal system to at least one of the volatile and nonvolatile memoriesand to the controller fails. For example, the external system may suffera power source outage or battery failure. When external system powerfails, the power controller 106 may provide backup power to the volatilememory 102, nonvolatile memory 104, and to the controller 110 for longenough to enable the backup of data from the volatile memory 102 to thenonvolatile memory 104. The capacitor or battery power source 108 mayact as the source of this backup power.

In some embodiments, the controller 110 may include logic to enable theexternal system to initiate a backup of data from the volatile memory102 to the nonvolatile memory 104, instead of waiting for a powerfailure to initiate the backup. The controller 110 may also compriselogic to emulate to the external system a type of volatile memory otherthan a type of the volatile memory. For example, internally the memorysubsystem may employ SDRAM for the volatile memory 102. However, thecontroller may include logic to emulate single data rate RAM (SDRAM),double data rate RAM (DDRAM), DDR2, asynchronous SRAM, C-F card, orPCI-Express (among other examples) to the external system.

The volatile memory 102, nonvolatile memory 104, controller 110, andpower controller 106 may implemented in various ways. For example, thesecomponents may be implemented as one of a multi-chip set, a boardsubsystem, or even a single chip.

The embodiment shown in FIG. 1 shows that backups and restores of dataare implemented as data moves from the volatile memory 102 to thenonvolatile memory 104, and vice versa, via the controller 110. In otherembodiments, backups and restores may be implemented via data moves fromthe volatile memory 102 to the nonvolatile memory 104 directly, withoutpassing through the controller 110.

FIG. 2 is a flow chart of an embodiment of a data backup process. Ifexternal system power fails (see 202), backup power from a local source,such as a capacitor, is applied to operate the memory subsystem (see204). Data is backed up from volatile memory to nonvolatile memory, see206. At 208 the process concludes.

The backup power source has been discussed in terms of one or morecapacitors local to the hybrid memory subsystem. However, the backuppower source, such as one or more capacitors, may also be provided bythe external system.

The backup power source may be applied upon failure of external systempower (i.e. the primary power source), which may involve some form ofswitching function from primary to backup power. Power switchingfunctions inherently involve some latency (switching time), which mayprovide a vulnerability to losing all power to the memory subsystem ifthe switching function fails, or becomes too slow. Thus, in someembodiments power is always supplied to the hybrid memory subsystem viathe backup power source. The hybrid memory subsystem may for examplealways draw power from one or more backup power capacitors, which inturn are continually recharged from external system power when suchpower is available. Upon external system power failure, the memorysubsystem continues to draw power from the backup power capacitors,drawing down their voltage, while for example performing a power-downsave of data in volatile memory 102 to nonvolatile memory 104.

Thus, the term “external system power” may refer to power from theexternal system as applied to the memory subsystem via one or morebackup power sources, such as power capacitors. The term “backup power”may refer to power applied to the memory subsystem via the backup powersources once power from the external system fails.

The memory subsystem is thus isolated from the external system that usesit in at least two ways. First, memory access isolation is provided byinterposing the controller interface 110 (which may or may not be thesame as the volatile memory 102 interface) between the memory subsystemand the external system. Second, power isolation from the main systemmay be provided by “gating” external system power through the backuppower source.

Upon restoration of external system power, logic of the controller 110may operate to restore data from the nonvolatile memory 104 to thevolatile memory 102.

FIG. 3 is a flow chart of an embodiment of a data restoration process.At 302, if there is restoration of external system power, the analogcontrol circuitry recognizes the power restoration. At 304, data isrestored from nonvolatile memory to volatile memory. At 306 the processconcludes.

FIG. 4 is a block diagram of an embodiment of a hybrid memory subsystemthat provides an external system with an SDRAM interface. The system isarchitecturally similar to the embodiment of FIG. 1. The hybrid memorysubsystem provides SDRAM-compatible data, address, and control/statussignaling to the external system. Thus, the external system may interactwith the hybrid memory subsystem in the same manner as it would interactwith a typical SDRAM. The external system need not have a modifiedinteraction with the hybrid memory subsystem that accounts for thepresence of the non-volatile memory 104. Interaction between thevolatile memory 102 and the non-volatile memory 104 in the event of apower failure are handled internally by the hybrid memory subsystem.Details of this interaction need not be exposed to the external system.

The controller 110 implements the interface to the non-volatile memory104 internally, so that this interface is not exposed to the externalsystem. The controller 110 comprises logic to drive the interactionsbetween the volatile memory 102 and the non-volatile memory 104 in theevent of failure or shutdown of external system power, and restorationof external system power.

In the embodiment of FIG. 4, the hybrid memory subsystem controller 110provides a ‘pass through’ of data, address, and control signals from theexternal system to the volatile memory 102. This is possible when thecontroller 110 provides the external system with a volatile memoryinterface that is consistent with the type of volatile memory actuallyused internally by the hybrid memory subsystem. For example, if theinterface to the external system is an SDRAM interface, and the hybridmemory subsystem uses SDRAM for volatile memory internally, thecontroller 110 may ‘pass through’ signals from the external system tothe internal SDRAM. Performance benefits may be obtained from such ‘passthrough’ signaling.

In the embodiment of FIG. 4, the hybrid memory subsystem controller 110may alternately provide a ‘re-clocking’ of data, address, and controlsignals from the external system to the volatile memory 102. This ispossible when the controller 110 provides the external system with avolatile memory interface that is consistent with the type of volatilememory actually used internally by the hybrid memory subsystem butretiming the signals by one or more clock delays. For example, if theinterface to the external system is an SDRAM interface, and the hybridmemory subsystem uses SDRAM for volatile memory internally, thecontroller 110 may ‘re-clock” or re-register” signals from the externalsystem to the internal SDRAM. Alternate performance behavior may beobtained from the approach of ‘re-clocking’ signals.

In other situations, the internal volatile memory 102 may be of adifferent type than the interface provided by the controller 110 to theexternal system. In this case, the controller 110 may translate signalsfrom the external system to be compatible with the type of the internalvolatile memory 102. There may be some performance cost associated withsuch signal translation.

The controller 110 may expose additional control/status signaling to theexternal system. This additional signaling may enhance and/or modify thetypical volatile memory interface exposed to the external system by thecontroller 110. The external system may or may not comprise logic totake advantage of this additional signaling.

Capacitor Power Delivery Verification

The capacitor 108 or other backup power source is a crucial componentfor enabling reliable operation of the memory subsystem in the event ofa discontinuation of external system power. Thus, it is important thatthe capacitor 108 or other backup power source always be operationallyready.

FIG. 5 is a block diagram of an embodiment of capacitor verificationlogic 502. The capacitor verification logic 502 may be comprised by thepower controller 106, although this need not always be the case. Theverification logic 502 may operate to verify proper function and ratingof one or more backup power capacitors.

Some embodiments may use multiple power capacitors. Using multiple powercapacitors may have several benefits, including delivery of additionalbackup power, and redundancy for more reliable operation. For example,if one power capacitor fails, the system may still operate reliablyusing backup power from the other capacitors. Capacitors are typicallyinexpensive relative to other system components, so that these benefitsmay be obtained at relatively low incremental cost over using a singlepower capacitor.

The logic 502 may verify that the at least one power capacitors, e.g.capacitor 108, has sufficient power to enable a data backup fromvolatile memory 102 of the memory subsystem to nonvolatile memory 104 ofthe memory subsystem in the event that external system power isdiscontinued.

Verification of the power capability of a capacitor may be accomplishedin a number of ways. One way is to time at least one of a charge anddischarge rate of the capacitor using a predetermined load and voltage.FIG. 7 is an illustration of an embodiment of a capacitor dischargecurve under a predetermined load (R) and voltage. Time T1 represents apoint on the discharge curve at which a first voltage measurement ismade, and T2 the point at which a second voltage measurement is made.Both measurements may be made within the capacitor's operational zoneduring a data backup. If the rate of discharge becomes too great, it mayindicate that the capacitor is of an improper value, miss-installed orhas degraded and is nearing the end of its reliable life.

Another way to verify capacitor power delivery capability is to measurean ending voltage of the capacitor at an end of a data backup operationfrom the volatile to the nonvolatile memories, and to determine if thereis a sufficient voltage margin to provide reliable data backup.Referring again to FIG. 7, the capacitor's voltage may be measured atT1, at the end of a complete data backup from volatile memory 102 tononvolatile memory 104. The voltage at T2 may represent a referencepoint for determining the capacitor's margin of operation. If thevoltage difference between T1 and T2 provides an insufficient margin ofoperation, the capacitor may be ending its useful reliable life or thepower load represented by the elements 102, 104, 106 and 110 or harshenvironmental conditions exceed that for which the subsystem wasdesigned.

Yet another way to verify capacitor power delivery capability is tomeasure a natural oscillation frequency of the capacitor when thecapacitor is re coupled to a predetermined impedance (one that includesan inductive component). FIG. 8 is a diagram of an embodiment of an LC(inductive-capacitive) loop circuit, i.e. an inductive RC oscillator.The inductance 804 may be coupled into a loop with the capacitor 802 forpurposes of power verification. The capacitor 802 may discharge into theinductance 804, and vice-versa, creating a natural resonance frequencyin the loop. This frequency may characterize the capacitance of thecapacitor 802, which provides an indication of the capacitor's 802 powerdelivery capability.

More advanced embodiments may go further, and may include logic tomeasure and apply one or more of an operating temperature, operatingvoltage, and component age of the capacitor when performing powerverification. Some embodiments may even apply prior operational behaviorof the system and/or capacitor when performing power verification.

Capacitor power verification may be performed under differentcircumstances. For example, verification may occur upon restoration ofexternal system power, after such power has been discontinued or whensuch power is applied for the first time. This situation is illustratedin FIG. 6, which is a flow chart of an embodiment of capacitor powerverification at system power-up.

In FIG. 6, external system power is applied (602) and capacitor powerdelivery capability is determined at that time (604). If the capacitorhas sufficient power capability (606), the memory subsystem is enabled(608). Otherwise, the memory subsystem is disabled (610). At 612 theprocess concludes.

In other embodiments, verification may occur periodically, after acertain time interval has passed, or at certain times of the day or oncertain dates. Verification may occur in response to a signal from theexternal system, such as a signal produced as a result of executing adiagnostic routine.

The verification logic 502 may signal the external system with anindication of the result of capacitor power verification. For example,the logic 502 may signal the external system with an indication that thememory system is fully functional, non-functional, or functional in adegraded mode of operation, according to a result of power verificationof the capacitor(s). The memory subsystem may, in some cases, be placedinto a degraded mode of operation if the power verification indicatesthat the capacitor(s) do not comprise enough power for a full databackup from volatile memory 102 to nonvolatile memory 104 in the eventof a discontinuation of external system power. One example of a degradedmode of operation is a reduction in the ‘advertised’ memory capacity ofthe memory subsystem. For example, if the verification logic 502determines that the power capacitor comprises only enough power tobackup 50% of the data in volatile memory 102 to nonvolatile memory 104,the memory subsystem may indicate to the external system that it onlyhas 50% of its fully-functional memory capacity.

In some embodiments, the verification logic 502 may prioritize the useof multiple capacitors for backup power according to results of powerverification. For example, all else being equal capacitor 108 may be theprimary backup power source, with other capacitors being second andtertiary sources. However, if verification indicates that capacitor 108is only operational at 60% of its full power rating, the verificationlogic may cause one of the backup capacitors to become the primarybackup power source instead, with a third capacitor being a secondarysource and the capacitor 108 the tertiary source.

Memory Subsystem Initialization

FIG. 9 is a flow chart of an embodiment of a process to initialize ahybrid memory subsystem. The memory subsystem may be initialized onfirst use, and/or at other times. The memory subsystem may beinitialized to place it into an operational power-up state withoutpopulating its volatile memory 102 with data stored in its non-volatilememory 104. In some embodiments, the controller 110 may initiate,direct, and/or perform the initialization.

Initialization may involve capacitor verification, described above, aswell as verification of the nonvolatile memory capability.

The nonvolatile memory capability may be verified (902), for example bychecking that the minimum amount of usable flash blocks are in an erasedstate to support a power loss save operation. This may take place inembodiments where flash memory is used for the nonvolatile memory 104.Verification that a usable flash block is in an erased state may involveexamining each erasable flash block to determine if it is “dirty”, i.e.has been programmed, and, if so, erasing it. A list of usable, erasedflash blocks may be established (904).

The presence and power delivery capability of the backup power sourcefor the hybrid memory subsystem may also be verified (906). The backuppower source may be a capacitor or capacitors. Verification of thepresence and power delivery capability of the backup power source helpsensure that in the event of power failure, sufficient backup power willbe available to backup the data content of the volatile memory 102 tothe nonvolatile memory 104. At 908, the initialization is complete.

Power Down Interrupt Recovery

FIG. 10 is flow chart of an embodiment of a process whereby the hybridmemory subsystem responds to a resumption of external system powerduring a power-down save operation initiated as a result of externalsystem power failure. In other words, the situation is one is whichexternal system power fails, and then is restored before the memorysubsystem can complete a backup of data from volatile memory 102 tononvolatile memory 104. The controller 110 may initiate, direct, and/orperform the power down interrupt recovery process.

“Interrupt Recovery Time” is the time between when external system poweris restored after failing, and when the memory subsystem is againavailable for use by the external system. To reduce the interruptrecovery time, the memory subsystem may signal the external system thatit is ready for use as soon as enough nonvolatile memory 104 space isavailable to completely backup the contents of volatile memory 102.

If another failure of external system power occurs while the system isprocessing a resumption of power, the power-down save operation that waspreviously interrupted by the resumption of external system power may beresume where it left off.

The memory subsystem may comprise logic to delay enabling use of thememory subsystem by the external system after a power down saveoperation of the memory subsystem is interrupted by restoration ofexternal system power. The delay will typically be at least long enoughto allow the memory subsystem to ensure that sufficient nonvolatilememory capacity of the memory subsystem is available to backup an amountof volatile memory capacity that the memory subsystem makes available(i.e. provides) to the external system.

In one embodiment, the delay is incurred while the memory subsystemerases sufficient dirty blocks of nonvolatile memory to backup theamount of volatile memory capacity that the memory subsystem provides tothe external system. However, if sufficient nonvolatile memory capacityis already available to backup the amount of volatile memory capacitythat the memory subsystem provides to the external system, no delay maybe incurred, and the memory subsystem may indicate its substantiallyimmediate availability to the external system.

In some embodiments, the memory subsystem may indicate to the externalsystem that it is available for use, but may update the amount ofvolatile memory capacity that it makes available to the external systemas more and more nonvolatile memory capacity is made available, forexample by erasing nonvolatile memory blocks.

At 1002, the memory subsystem examines whether the backup power source,in this embodiment a capacitor, has enough power to handle a completepower down operation, including backup of data from volatile memory 102to nonvolatile memory 104. In some embodiments, 1002 may not take placeevery time during power down interrupt recovery. The return of externalpower during a power down backup operation may result in the suspensionof the backup process from volatile memory 102 to nonvolatile memory104. In this situation, the volatile memory 102 continues to have powerand retain its data content. It may therefore be unnecessary to continuethe backup of data of the volatile memory 102 to nonvolatile memory 104if external system power is restored before completing the backup orrunning out of backup power. Nonetheless, the memory subsystem may notsignal the external system that it is ready for use until there issufficient usable and erased memory capacity in the nonvolatile memory104 for a complete backup of the contents of the volatile memory 102.Otherwise, if external system power failed again very soon after it wasrestored, it might create a situation in which there was not enoughcapacity in the nonvolatile memory 104 to completely backup the contentsof the volatile memory 102, and valuable data could be lost.

An evaluation (1004) is made of whether there is enough usable erasedflash memory blocks to perform a backup of the contents of volatilememory 102 to non-volatile memory 104 in the event of a subsequentfailure of external system power. The next data block is erased (1006)until there are a sufficient number of erased and available nonvolatilememory blocks. When there are enough usable erased flash memory blocksto perform a data backup of volatile memory 102 to nonvolatile memory104, the memory subsystem indicates that it is available for use by theexternal system (1008). This indication may take the form of a signal tothe external system, or a status indication available for reading by theexternal system. At 1010, the process is complete.

If the power fails at any time after one or more flash memory blocks areerased at 1006, the interrupt recovery process is terminated and databackup resumes from volatile memory 102 to nonvolatile memory 104 forthe blocks that were erased, but not necessarily for blocks that werenot erased (unerased blocks remain backed up in the nonvolatile memory).Thus, the memory subsystem may include logic to erase sufficient dirtynonvolatile memory to backup the amount of volatile memory capacity thatthe memory subsystem provides to the external system before enabling useof the memory subsystem by the external system. In the event thatexternal system power fails before enabling use of the memory subsystem,the memory subsystem may backup at least portions of the volatile memoryhaving data corresponding to data erased from the nonvolatile memory.

FIG. 11 is a memory allotment map for several power down nonvolatilememory capacity situations. Again, the controller 110 may initiate,direct, and/or perform this process.

A flash memory 104 comprises “dirty” blocks 1102, which have beenprogrammed, and “usable” blocks 1104 which are in an erased state andnot otherwise impaired. In FIG. 11 the area between the dotted linesindicates a quantity of nonvolatile memory 104 needed to perform a databackup of the entire contents of the volatile memory 102, in the eventof external system power failure. In condition A, although thenonvolatile memory 104 has some dirty blocks 1102, there are more thanenough usable erased blocks 1104 to perform a data backup operation. Infact, the total flash memory capacity may often be over two times thesize of the volatile memory 102, so in that case there will typically beenough erased blocks available to backup the volatile memory 102contents in the event of external system power failure. The memorysubsystem should thus be available soon after external system power upfor use by the external system.

The dirty blocks and erased usable blocks are illustrated as contiguousranges. However, such contiguous placement may not always be the case,and the process is generally the same regardless of the contiguous ornoncontiguous nature of the nonvolatile memory blocks.

The nonvolatile memory 104 as illustrated in state B also has dirtyblocks 1102 and erased usable blocks 1104. In this case, however, thereare not enough erased and useable blocks in the nonvolatile memory 104to fully backup the contents of the volatile memory 102. A portion 1106of the space needed to backup the volatile memory 102 is not yetavailable as erased blocks.

The nonvolatile memory 104 as illustrated in state C may have originallyhad the same quantity of dirty and erased flash blocks as in state B.However, the quantity 1106 of erased blocks which were needed butunavailable in state B have now been obtained through erasure of dirtyblocks in the memory 104. Therefore, the memory 104 in state C now hasfewer dirty blocks and more erased blocks than it did in state B, withthe result that it has enough erased usable blocks to perform a backupof the entire contents of the volatile memory 102. When performing anerasure of dirty blocks, it is not necessary that the blocks that areerased are done so in any particular location or order. The memorysubsystem may indicate to the external system that it is ready for useonce the number of useable and erased blocks is equal or greater thanthe amount of the volatile memory 102 that will be used by the externalsystem.

Power Up Restore

FIG. 12 is a flow chart of an embodiment of the power up restore processfor a hybrid memory subsystem. The power up process may include a datarestore from nonvolatile (e.g. flash) memory 104 to volatile memory 102.As with other procedures described herein, the controller 110 mayinitiate, direct, and/or perform the power up process.

Once the external system power is available (1202), if initializationprocess has not been performed (1204), initialization is commenced atFIG. 9, 902.

If the subsystem is in a properly initialized state, one flash memorypage of data is restored to volatile memory (1206). This continues solong as more flash memory pages are available to be restored (1208).

When all flash memory pages containing data to be restored to volatilememory have been processed, the action continues at 1004 of FIG. 10.

If the external power fails anytime during 1204, 1206, or 1208, theprocess may be terminated. The memory subsystem may thus include logicto eliminate a data backup from volatile memory 102 of the memorysubsystem to nonvolatile memory 104 of the memory subsystem if externalsystem power is restored before the data backup is completed.

Data from volatile memory 102 remains fully backed up in nonvolatilememory 104, and nothing more need be done in terms of backup and restorebefore shutting down the memory subsystem. Typically, the memorysubsystem may not begin erasing blocks in nonvolatile memory 104 untilthe restore is fully performed.

Thus, the memory subsystem may include logic to restore data from thenonvolatile memory 104 to the volatile memory 102 after restoration ofexternal system power, but before ensuring that sufficient nonvolatilememory capacity of the memory subsystem is available to backup an amountof volatile memory capacity that the memory subsystem provides to theexternal system. The memory subsystem may restore the data from thenonvolatile memory 104 to the volatile memory 102 after restoration ofsystem power only if the restoration of system power did not interrupt apower down save operation.

Power Down Save

FIGS. 13 and 14 are flow charts of an embodiment of a hybrid memorysubsystem power down process, invoked after external system power fails.The power control logic 106 may detect external system power failure andsignal the controller 110. The controller 110 may initiate, direct,and/or perform the power down process.

The memory subsystem may first disable the external system's use of thememory subsystem (1302). This disabling of the external system isusually done with the awareness and participation of the external systemsuch that the external system may complete any atomic data operations.Once disabled, data may then be read from the volatile memory (1304).This data may be written to a non-volatile memory page (1306). Thenon-volatile memory page just written may now be written with data(1308). Non-volatile memory pages may be written in small dataincrements (whereas they are typically read or erased in increments ofone block at a time). The amount of data read from volatile memory maynot fill the non-volatile memory page, in which case more data forwriting is read from volatile memory (1304). The non-volatile memorypage is full at 1314.

A new nonvolatile memory page programming operation may now beperformed. The integrity of data not yet read from the volatile memoryshould be preserved for the duration of this page programming operation.For DRAM memories requiring refresh this may be accomplished byperforming a burst refresh of the volatile memory based on the worstcase duration of the page program time. A new non-volatile memory pageis programmed at 1314. Processing continues at FIG. 14, 1402.

If there is more data to save to nonvolatile memory and more pages ofnon-volatile memory to program (1402), volatile memory is returned fromthe low power mode to a fully operational state so that it may be readto obtain the unsaved data (1404). Processing continues at FIG. 13,1304.

If there is not more data to save from volatile to nonvolatile memory,the memory subsystem is shut down (1406), and the process is complete(1408).

Thus, the memory subsystem may include logic to burst refresh thevolatile memory 102 for a time at least equal to a worst-casenonvolatile page preparation time, to place the volatile memory 102 intoa lower than fully operational power state while a new nonvolatilememory page is prepared and written, and to restore the volatile memory102 to a fully operational power state after the new nonvolatile memorypage is prepared and written.

FIG. 15 is a block diagram of an embodiment of variable partitioning ina hybrid memory subsystem.

A set of registers 1510 or other mechanism may be employed to providethe external system with a capability to configure the volatile memory102 and/or the nonvolatile memory 104 of the memory subsystem. In somesituations the memory subsystem may be “hard wired” for a particularconfiguration.

The configuration provides that one or more portions 1502 of thevolatile memory 102 are supported by backup capacity 1506 of thenonvolatile memory. The external system may read and write data from andto these portions 1502 as if interacting with volatile memory (e.g.using a RAM data/address protocol), but these portions 1502 will bebacked up automatically to nonvolatile memory 104 in the event ofexternal system power failure. Hence, these portions 1502 may beconsidered by the external system to be nonvolatile memory having thespeed and usability advantages of volatile memory.

Other portions 1504 of the volatile memory 102 may be used by theexternal system as standard volatile memory. In other words, theexternal system may read and write data from and to these portions 1504as if interacting with volatile memory (e.g. using a RAM data/addressprotocol), but, like typical volatile memory, these portions 1504 willnot be backed up automatically to nonvolatile memory 104 in the event ofexternal system power failure.

Other portions 1508 of nonvolatile memory 104 may be used by theexternal system as nonvolatile memory. The external system may read andwrite data to these portions 1508 directly, i.e. via the controller 110without first writing the data to volatile memory 102 from where it isbacked up to nonvolatile memory 104.

Thus, the hybrid memory subsystem may be configured to provide threetypes of memory to the external system. One type is “nonvolatile” memory1502 having the interaction advantages (e.g. speed, reusability) ofvolatile random access memory, and backed up automatically to a portion1506 of nonvolatile random access memory in the event of system powerfailure. Another type of memory provided to the external system isstandard random access volatile memory 1504. Still another type providedto the external system is standard nonvolatile memory 1508 accessed in amanner native to the nonvolatile memory (block-sequential rather thanrandom accessed).

The portion 1508 of nonvolatile memory that is not reserved for backupsof volatile memory 1502 may contain program code or other informationand may be “booted” or otherwise loaded into the portion 1504 ofvolatile memory that is not backed up. Thus, the nonvolatile memory 104may act as a repository of program code or other “image” information foruse by the external system.

Thus, the volatile memory 102 may be partitioned into three logicalmemory regions: “nonvolatile memory” (1502) which is volatile memorythat is backed up to nonvolatile memory in the event of system powerfailure; volatile memory (1504) which is volatile memory that will notbe backed up if system power fails; and volatile memory (alsopotentially in portion 1504) that will not be backed up if system powerfails, but which has a corresponding image in the portion 1508 ofnonvolatile memory that is not reserved for backups.

The hybrid memory subsystem may thus include logic to make available tothe device into which it is installed at least one portion of thevolatile memory that will be backed up to the nonvolatile memory in theevent of device power failure. The logic may make available to thedevice at least one portion of the volatile memory that will not bebacked up to the nonvolatile memory in the event of device powerfailure, and make available to the device at least one portion of thenonvolatile memory that is not reserved for backups from the volatilememory.

The memory subsystem may include one or more configuration registers toenable the device to specify at least one portion of the volatile memorythat will be backed up to the nonvolatile memory in the event of devicepower failure, and to enable the device to specify at least one portionof the nonvolatile memory that is not reserved for backups from thevolatile memory.

Those having skill in the art will appreciate that there are variousvehicles by which processes and/or systems described herein can beeffected (e.g., hardware, software, and/or firmware), and that thepreferred vehicle will vary with the context in which the processes aredeployed. For example, if an implementer determines that speed andaccuracy are paramount, the implementer may opt for a hardware and/orfirmware vehicle; alternatively, if flexibility is paramount, theimplementer may opt for a solely software implementation; or, yet againalternatively, the implementer may opt for some combination of hardware,software, and/or firmware. Hence, there are several possible vehicles bywhich the processes described herein may be effected, none of which isinherently superior to the other in that any vehicle to be utilized is achoice dependent upon the context in which the vehicle will be deployedand the specific concerns (e.g., speed, flexibility, or predictability)of the implementer, any of which may vary. Those skilled in the art willrecognize that optical aspects of implementations may involveoptically-oriented hardware, software, and or firmware.

The foregoing detailed description has set forth various embodiments ofthe devices and/or processes via the use of block diagrams, flowcharts,and/or examples. Insofar as such block diagrams, flowcharts, and/orexamples contain one or more functions and/or operations, it will beunderstood as notorious by those within the art that each functionand/or operation within such block diagrams, flowcharts, or examples canbe implemented, individually and/or collectively, by a wide range ofhardware, software, firmware, or virtually any combination thereof.Several portions of the subject matter described herein may beimplemented via Application Specific Integrated Circuits (ASICs), FieldProgrammable Gate Arrays (FPGAs), digital signal processors (DSPs), orother integrated formats. However, those skilled in the art willrecognize that some aspects of the embodiments disclosed herein, inwhole or in part, can be equivalently implemented in standard integratedcircuits, as one or more computer programs running on one or morecomputers (e.g., as one or more programs running on one or more computersystems), as one or more programs running on one or more processors(e.g., as one or more programs running on one or more microprocessors),as firmware, or as virtually any combination thereof, and that designingthe circuitry and/or writing the code for the software and/or firmwarewould be well within the skill of one of skill in the art in light ofthis disclosure. In addition, those skilled in the art will appreciatethat the mechanisms of the subject matter described herein are capableof being distributed as a program product in a variety of forms, andthat an illustrative embodiment of the subject matter described hereinapplies equally regardless of the particular type of signal bearingmedia used to actually carry out the distribution. Examples of a signalbearing media include, but are not limited to, the following: recordabletype media such as floppy disks, hard disk drives, CD ROMs, digitaltape, and computer memory; and transmission type media such as digitaland analog communication links using TDM or IP based communication links(e.g., packet links).

In a general sense, those skilled in the art will recognize that thevarious aspects described herein which can be implemented, individuallyand/or collectively, by a wide range of hardware, software, firmware, orany combination thereof can be viewed as being composed of various typesof “electrical circuitry.” Consequently, as used herein “electricalcircuitry” includes, but is not limited to, electrical circuitry havingat least one discrete electrical circuit, electrical circuitry having atleast one integrated circuit, electrical circuitry having at least oneapplication specific integrated circuit, electrical circuitry forming ageneral purpose computing device configured by a computer program (e.g.,a general purpose computer configured by a computer program which atleast partially carries out processes and/or devices described herein,or a microprocessor configured by a computer program which at leastpartially carries out processes and/or devices described herein),electrical circuitry forming a memory device (e.g., forms of randomaccess memory), and/or electrical circuitry forming a communicationsdevice (e.g., a modem, communications switch, or optical-electricalequipment).

Those skilled in the art will recognize that it is common within the artto describe devices and/or processes in the fashion set forth herein,and thereafter use standard engineering practices to integrate suchdescribed devices and/or processes into larger systems. That is, atleast a portion of the devices and/or processes described herein can beintegrated into a network processing system via a reasonable amount ofexperimentation.

The foregoing described aspects depict different components containedwithin, or connected with, different other components. It is to beunderstood that such depicted architectures are merely exemplary, andthat in fact many other architectures can be implemented which achievethe same functionality. In a conceptual sense, any arrangement ofcomponents to achieve the same functionality is effectively “associated”such that the desired functionality is achieved. Hence, any twocomponents herein combined to achieve a particular functionality can beseen as “associated with” each other such that the desired functionalityis achieved, irrespective of architectures or intermedial components.Likewise, any two components so associated can also be viewed as being“operably connected”, or “operably coupled”, to each other to achievethe desired functionality.

1.-20. (canceled)
 21. A memory subsystem for use in a device,comprising: volatile memory; nonvolatile memory; and logic to makeavailable to the device at least one first memory partition of thevolatile memory that will be backed up to the nonvolatile memory in theevent of device power failure, including unmodified areas in the firstpartition; and logic to make available to the device at least one secondmemory partition of the volatile memory that that can be modified by thedevice but that will not be backed up to the nonvolatile memory and willlose any date stored therein in the event of device power failure. 22.The memory subsystem of claim 21, further comprising: logic to makeavailable to the device at least one portion of the nonvolatile memorythat is not reserved for backups from the volatile memory.
 23. Thememory subsystem of claim 21, further comprising: one or moreconfiguration registers to enable the device to specify the at least oneportion of the volatile memory that will be backed up to the nonvolatilememory in the event of device power failure.
 24. The memory subsystem ofclaim 22, further comprising: one or more configuration registers toenable the device to specify the at least one portion of the nonvolatilememory that is not reserved for backups from the volatile memory.
 25. Adevice comprising: a memory subsystem comprising volatile memory,nonvolatile memory, and logic configure at least one first memorypartition of the volatile memory that will be backed up to thenonvolatile memory in the event of power failure to the device, thebackup including unmodified areas in the first partition; and logic toconfigure at least one second memory partition of the volatile memorythat that can be written with data but that will not be backed up to thenonvolatile memory and will lose data stored therein in the event of thepower failure.
 26. The device of claim 25, the memory subsystem furthercomprising: logic to configure at least one portion of the nonvolatilememory that is not reserved for backups from the volatile memory. 27.The device of claim 25, the memory subsystem further comprising: one ormore configuration registers to configure the at least one portion ofthe volatile memory that will be backed up to the nonvolatile memory inthe event of device power failure.
 28. The device of claim 26, thememory subsystem further comprising: one or more configuration registersto configure the at least one portion of the nonvolatile memory that isnot reserved for backups from the volatile memory.
 29. A method ofconfiguring memory in a device, comprising: configuring at least onefirst partition of volatile memory of a memory system of the device tobe backed up to nonvolatile memory of the memory system in the event ofdevice power failure, the backup including unmodified areas of the firstpartition; and configuring at least one second partition of the volatilememory to be not backed up to the nonvolatile memory in the event ofdevice power failure so that the memory content of the second partition,including modified content, are lost in the event of the power failure.30. The method of claim 29, further comprising: configuring at least oneportion of the nonvolatile memory to be not reserved for backups fromthe volatile memory.